Teledyne Technologies

Staff Hardware Engineer

Job Locations US-CA-Milpitas
Requisition ID
2018-6196
Company Name
Teledyne LeCroy PSG
Shift
1st Shift - Day
Citizenship/Visa Requirement
US Citizen/Perm Resident/ Other US Person

Company Overview

Teledyne Lecroy develops leading edge test and measurement products which engineering teams around the globe use to develop next generation communication, consumer electronics and computer products.

 

 

 

 

 

 

 

Position Summary and Responsibilities

System level hardware design engineer with emphasis on high speed digital design. Responsibilities will include board and system level design, PCB layout, simulations, component selection and support to manufacturing /customer support on various acitivites. This is a product development position requiring thorough background in developing high end systems including high speed simulation, layout guidence, and working with Mech Engr for enclosure design and associated sub assemblies.

 

Board and system level high speed digital circuit design, integration, and evauation.

Perform high speed circuit simulation (HSPICE, Hyperlinx, ADS, HFSS etc) and be responsible for board design and functionality

Generate PCB layout guidelines and work with outside PCB layout service providers. Knowledge in high speed (> 10Gbps) layout is required

Perform board bring up and work with firmware/logic engineers to ensure product functionality.

Develop system and board level tests and test procedures to ensure that the product meets electrical and engineering specifications. Use these procedures to transfer products to Operations

Work with mechanical engineer to design product enclosure and cross check with electrical designs.

Design and implement unit characterization tests, production tests and integration tests. Execute, analyze and verify test results.

Assist in EMC certification as necessary

Support Manufacturing and Customer Support on various issues.

Qualifications

  • Minimum of 10 years of system/board level design exp designing and developing high end, high speed embedded platforms including latest bus topologies, CPU, and memory interfaces.
  • Excellent knowledge of high speed (10Gbps or higher) design methodologies and simulation, including latest bus technologies such as PCIe, USB, SAS/SATA and/or Ethernet.
  • Excellent knowledge in high speed clock circuit design, implementation and measurements.
  • Knowledge in high speed simulation using HSpice, Hyperlinx, or similar tools and applying the concepts to board layout.
  • Good interpersonal, organizational and communication skills.
  • Strong background in debug, high speed Timing, and Jitter analaysis and measurement.
  • Working knowledge of various EMC/EMI control methods and implementation at PCB/component level.
  • Working experience with various schematic entry tools and test/measurement equipment including high speed, real time oscilloscopes, network/spectrum analyzers, and logic analyzers.
  • Strong system development experience with wholistic approach.
  • Team player. Be able to share knowledge, learn from others, and support other groups within an organization.
  • Preferred: FPGA logic development experience.
  • Education: BS/MS in EE or CE (MS preferred)

Teledyne is an Equal Opportunity/Affirmative Action employer.  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, gender, sexual orientation, gender identity, gender expression, transgender, pregnancy, marital status, national origin, ancestry, citizenship status, age, disability, protected Veteran Status, genetics or any other characteristic protected by applicable federal, state, or local law.    

If you need assistance or an accommodation while seeking employment, please email  teledynerecruitment@teledyne.com or call (805)373-4545.  Determinations on requests for reasonable accommodation will be made on a case-by-case basis.  Please note that only those inquiries concerning a request for reasonable accommodation will receive a response.  

 

Requisition Post Information* : Posted Date

2/6/2018

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