Teledyne Microwave Solutions has over 50 years of experience in the design, development, and manufacture of sophisticated microwave/RF components and integrated assemblies for the most demanding challenges. Our products and capabilities are sought after by civilian and military organizations spanning numerous global markets, including Aviation, Communication, Electronic Warfare (EW/ECM/CIED), Industrial, Missile/UAV, Radar, Satcom, Space, and Test and Measurement. Teledyne Microwave Solutions invests heavily in research and development to maintain the ability to offer the world’s most advanced MW/RF capabilities for current and emerging challenges.
Teledyne Microwave Solutions is hiring a Swing Shift Assembler that must be proficient in ball bonding, wedge bonding, die attaching, and gap welding. Must be able to work on small components under a microscope. Must be able to assemble and disassemble units as necessary and preform rework or repair on units. Quality of work is very important, must have very clean work. Candidate will be doing rework on units from QA and from the technicians. They will also have to preform bond pull and other duties as assigned. Must have at least five years experience working on RF amplifiers.
Must be able to ball bond, wedge bond, ribbon bond, gap weld, die attach and solder. J-standard solder certification is preferred. Candidates must also be able to assemble and hook up amplifiers and sub-assemblies. Must be able to read and follow instructions on assembly drawings. High school or equivalent required. Three to five years of experience minimum preferred. US person.